Industry Judgment Report · Semiconductor 2026

Design crowded,
materials scarce, advanced nodes constrained

A supply-landscape judgment built on 199 A-share and HK-listed companies. It answers one question directly: where China’s semiconductor localization is strong and where it is stuck.

Sample: 199 listed entities Scope: 21 sub-segments Baseline: 2026 interim + 2025 annual reports
199
entities across design / equipment / materials / foundry / OSAT
116 firms
chip design, 58.3% — supply concentrated on one end
8 segments
key segments are supply-thin, in materials & manufacturing
7 segments
carry real substitution constraints, plus 1 thin but unconstrained
SCROLL
EXECUTIVE SUMMARY

Read this first: the real problem is materials and advanced nodes, not design

Conclusion first · evidence after
In one sentence

China’s listed semiconductor supply is heavily concentrated in design; the real localization constraints sit in key materials and advanced nodes — not in the design segment itself.

199listed entities
Chip design116 58.3%
Equipment33 16.6%
Materials30 15.1%
OSAT13 6.5%
Foundry6 3.0%
Three core findings
Moving from “leader descriptions” to “supply-landscape judgment” surfaces three structural conclusions
Imbalance
6.1×
Materials scarcity
31 firms
Real constraints
7 / 8

① Design firms are 6.1× the combined foundry + OSAT; ② the 8 scarce segments total just 31 firms, fewer than logic SoC alone; ③ 7 of them carry independent barrier and external-dependence evidence — real substitution constraints.

01 · PURPOSE & VALUE

Research question and value

Semiconductors are the core chokepoint of US–China tech competition, and localization (self-reliance) is national strategy. Yet the question of “where strong, where lacking” has long rested on impressionistic descriptions of a few dozen leaders — far too thin to support resource allocation or investment judgment.

This report expands the sample from a few dozen leaders to 199 listed entities, then uses three layers of evidence — entity count → capital barrier → external dependence — to strictly separate two concepts that are often conflated:

Scope discipline · held throughout
What this report measures, and what it does not
Does

The distribution of listed entities — a quantifiable, reproducible structural fact.

Does not

A “localization rate” — the report claims no localization rate and does not equate “supply-thin” with “chokepoint.”

Boundary

Conclusions hold only for listed entities; unlisted startups and overseas entities are outside the sample.

02 · THE LANDSCAPE

The landscape: supply tilts heavily toward design

199 entities · five segments
Supply-chain entity structure
Design, at 116 firms, is 6.1× the 19 foundry + OSAT
6.1×design / mfg
Chip design116 58.3%
Equipment33 16.6%
Materials30 15.1%
OSAT13 6.5%
Foundry6 3.0%
Unclassified1 0.5%
Design sub-segments · 116 firms
Logic and analog account for 55.2% of design firms
Logic SoC
38 32.8%
Analog
26 22.4%
Power
18 15.5%
Memory
11 9.5%
RF
8 6.9%
Sensor / MCU / Opto
4 3.4%
CIS
3 2.6%
Structural observation

The supply structure visible to capital markets is markedly unbalanced — manufacturing and materials density is far below design. This is a fact, not a conclusion.

Listing board · 199 entities
The STAR Market is the dominant channel (62.3%)
STAR Market
124 62.3%
ChiNext
37 18.6%
Main board
31 15.6%
HK-listed
7 3.5%
Market-cap tiers · 199 entities
Mid-caps dominate, small-caps hold a quarter
Mid 100–1000b
120 60.3%
Small <100b
51 25.6%
Large ≥1000b
28 14.1%

The old “leader whitelist” inherently excluded small-caps; only after widening the sample did 51 small-cap entities surface — the value of a full-coverage judgment.

03 · WHERE SUPPLY IS THIN

Core finding: 8 key segments are supply-thin

Scarce ≠ constrained
Numerical inversion

Photoresist, specialty gas, targets, wet chemicals, and CMP — plus foundry, CIS, and sensors — total 31 firms, still fewer than logic SoC alone at 38.

Entity counts · scarce segments vs. benchmark
Listed-entity density in scarce segments is far below the crowded design lanes
Logic SoC (benchmark)
38 19.1%
Foundry
6 3.0%
Photoresist
5 2.5%
Specialty gas
4 2.0%
Sputtering targets
4 2.0%
Sensors
4 2.0%
Wet chemicals
3 1.5%
CIS
3 1.5%
CMP materials
2 1.0%

Color key: ■ red = scarce and constrained; ■ amber = scarce but with insufficient evidence to call it a constraint.

04 · THE FRAMEWORK

The method: thin does not equal constrained

Three layers · tightened at each step

This report does not equate “few entities” with “chokepoint.” Instead it uses a three-layer judgment, where each layer requires independent evidence to advance — conclusions are written only as far as the data supports.

Layer 1 · Fact

Supply-thin

Few listed entities. A quantifiable statistical fact, and nothing more — no strategic meaning attached.

Layer 2 · Structure

Structural supply constraint

On top of thinness, independent evidence of capital, technical, or certification barriers turns it into a “high-barrier scarce segment.”

Layer 3 · Strategy

Actual substitution constraint

Add import dependence, local share, customer certification, or technology-gap evidence to classify it as a “real localization constraint.”

The point most often misread

The barrier is capital formation — the enormous capex of building fabs and production lines — not R&D spending. None of the 8 scarce segments has higher R&D intensity than design.

Capital intensity · relative to design benchmark (1.0×)
The barrier is capital formation, not R&D intensity
Foundry
10.6×
Photoresist
8.0×
Specialty gas
3.3×
Wet chemicals
3.3×
CMP materials
2.4×
Targets
1.7×
CIS
1.1×
Sensors
0.63×

The vertical line is the design benchmark (1.0×). Sensors fall below it — the only segment that is both thin and without a capital barrier, so it must not be lumped with the other 7.

Global semiconductor sales · SIA
The industry itself is high-growth; supply judgments belong in that context
2023 · 526.8 2024 · 630.5 2025 · 791.7 USD billion · global semiconductor sales (+25.6% YoY)
1,431.3bn RMB
China IC industry sales · 2024
90%
Foundry CR5 · 2024Q4
484.3bn units
China IC output · 2025
05 · SEGMENT-BY-SEGMENT

Segment by segment: 7 constraints, 1 exception

Evidence tiered · honestly labeled

Eight scarce segments, checked one by one: 7 hit independent external-dependence evidence and constitute real substitution constraints; sensors are the exception — thin, but with neither a capital barrier nor external-dependence evidence.

PhotoresistHigh constraint
Listed entities5 firms
Capital barrier8.0×
Local share / dependence≈8% high-end >90%
Representative: Yoke, Qingyi Photomask, Luwei Photomask, Hengkun, Longtu Photomask
Verdict: semiconductor-grade local share ~8%, Japan’s top four hold ~76% globally, 2–3-year customer certification — high barrier plus high dependence, long substitution cycle.
Specialty gasHigh constraint
Listed entities4 firms
Capital barrier3.3×
Local share / dependence<25% high-end near-total reliance
Representative: Huate Gas, Jinhong Gas, Nata Opto, CSSC Specialty Gas
Verdict: local share under a quarter, 1–3-year new-supplier certification, high-purity grades still overseas-dominated.
Sputtering targetsHigh-end constraint
Listed entities4 firms
Capital barrier1.7×
Overall / high-end≈40% high-end JP/US-led
Representative: Jiangfeng, GRINM, Achue Material, Oulay Materials
Verdict: overall share up from single digits to ~40%, but sub-7nm / HBM high-end targets remain led by JX, Honeywell, and Tosoh.
Wet chemicalsHigh-end constraint
Listed entities3 firms
Capital barrier3.3×
Overall / G5 grade50–60% G5 only 25–30%
Representative: Jingrui, Shanghai Sinyang, Essen
Verdict: overall local share is already meaningful; the constraint is in the highest-purity G5 grade.
CMP materialsHigh-end constraint
Listed entities2 firms
Capital barrier2.4×
Pad concentrationoverseas >50%
Representative: Dinglong, Anji Microelectronics
Verdict: polishing pads are led by Dow / DuPont at over half the global share — a clear high-end substitution constraint.
CISValue constraint
Listed entities3 firms
Capital barrier1.1×
Units / revenue55%+ vs ≈25%
Representative: GalaxyCore, OmniVision (Will), SmartSens
Verdict: “wins on volume, trails on value” — unit share past half, but high-value revenue share still clearly lags.
FoundryProcess constraint
Listed entities6 firms
Capital barrier10.6×
Process gap2–2.5 generations
Representative: SMIC, Hua Hong, Nexchip, CXMT
Verdict: mature-node supply is ample and over-utilized; the constraint is advanced nodes — EUV lithography is blocked, leaving a 2–2.5 generation gap to TSMC.
SensorsInsufficient to judge
Listed entities4 firms
Capital barrier0.63×
External dependenceNo independent evidence
Representative: Goodix, Raytron, MEMSensing, CoreMotion
Verdict: thin but below benchmark on capital intensity, with no independent barrier evidence — a counter-example showing “thin” does not mean “chokepoint.”
CIS · unit-volume basis
55%+
The Chinese trio’s smartphone CMOS unit share jumped from under 40% to over 55% — volume substitution is past the halfway mark.
CIS · revenue basis
≈25%
Sony still holds nearly half of global CIS revenue; the Chinese trio’s 2024 CIS revenue combined is only about one-third of Sony’s.

CIS’s constraint is “insufficient value-side substitution,” not an overall supply shortage — volume substitution is ahead, value substitution behind.

Foundry · mature vs. advanced
The dependence is in advanced nodes, not total capacity
MetricChina mainlandTSMC
Most advanced mass-production node12nm / 7nm risk3nm / 2nm
Sub-7nm revenue shareHua Hong mostly ≥40nm≈70%
Core bottleneckNo EUV accessEUV available
ASP per wafer≈RMB 7,100≈RMB 27,600

Mature-node capacity is ample: SMIC ~1.02m wafers/month at 93% utilization; Hua Hong 106%; Nexchip >103%. China’s 8-inch share is ~22% globally.

06 · WHAT TO DO

Three constraint types, three decision lenses

Decision implications · differentiated by constraint type
Capital-formation barrier

Watch capacity formation

For targets, CMP, and wet chemicals, the barrier is building production lines — the focus should be effective capacity ramp and yield, not R&D spending alone.

Customer-certification barrier

Watch customer lock-in and patient capital

Photoresist and specialty gas carry 2–3-year certification cycles; passing certification locks in the relationship — substitution hinges on certification progress and customer adoption, not current share.

Equipment dependence

Watch process breakthrough

The foundry constraint is in advanced nodes, rooted in upstream EUV lithography limits — watch equipment access and domestic equipment breakthroughs, not total capacity.

07 · BOUNDARIES

Boundaries and distinctions

Scope boundaries · key distinctions
Counter-example · Sensors

Thin, but not necessarily constrained

Sensor entities number in the single digits, yet their capital intensity is below benchmark with no external-dependence evidence — so they cannot be classified as a constraint. This proves the method can tell apart segments without barriers, rather than promoting every thin segment.

Boundary case · CIS

Volume substitution ahead, value substitution behind

Chinese smartphone CMOS unit share exceeds 55%, but on a revenue basis overseas players still hold over 75% globally. A single “localization rate” cannot capture this “wins on volume” structural gap.

Targeted dependence · Foundry

Process dependence, not capacity scarcity

China’s mature nodes are already a major global supply base (8-inch at ~22% globally), with ample supply. The constraint is precisely the external equipment dependence of advanced nodes.

Scope boundary · Listed entities

Conclusions do not generalize to the whole industry

Unlisted startups, non-listed IDMs, and overseas foundries are outside the sample, so conclusions hold only for listed entities and do not claim to represent the entire Chinese semiconductor industry.

08 · METHODOLOGY

Method and data sources

Reproducible · verifiable
Sample

199 listed entities, not a few dozen leaders

Covering design, equipment, materials, foundry, and OSAT across 21 sub-segments, with sub-segment classification auto-verified against 2026 interim revenue composition.

Barrier evidence

Capital intensity + R&D intensity, dual proxies

Capital formation is measured as cash spent on fixed assets over revenue, and R&D as R&D expense over revenue (2025 annual-report basis), splitting “high barrier” into two measurable axes.

External dependence

Import dependence, local share, and customer certification

External evidence is collected per segment and verified against original sources; unverified estimates are never presented as high-precision figures.

Data sources

Authoritative figures + primary filings

Industry totals come from SIA, CSIA, TrendForce, SEMI, and the National Bureau of Statistics; entity dimensions come from company periodic reports.

Boundaries and limitations · honestly disclosed
These limits do not weaken the conclusions, but they define their scope
01

Scope: this report measures the distribution of listed entities, not a “localization rate”; “supply-thin” is a count fact and does not equal “chokepoint.”

02

Sample: listed entities only; unlisted startups, non-listed IDMs, and overseas entities are systematically absent, so conclusions cannot be generalized.

03

Timing: market-cap tiers are a snapshot at retrieval and fluctuate with prices; the RMB 100b / 10b thresholds are researcher-defined, not regulatory.

04

Local share: mostly third-party estimates, single-source and single-year with wide divergence; uncross-checked figures are not presented at high precision.

05

Statistical nature: all distributions are cross-sectional snapshots with no time series, so no trend judgment is made.